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Global Flip Chip Bonder Market 2019 Applications, Types, New Technology – Opportunity Analysis And Forecast: – 2025

Flip Chip Bonder

Global Flip Chip Bonder Market Report 2019 goes deeper into specific segments of the market such as application, regional markets, products, types, end-users, and emerging trends. Different presentational and illustrative tools like graphs, tables, charts, comparison tables back the analytical and statistical data in this report.

This report studies the global Flip Chip Bonder Market analyzes and researches the Flip Chip Bonder development status and forecast in the United States, EU, Japan, China, India, and Southeast Asia. This report focuses on the top players in the global market.

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Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:, 1. Die is picked up and place on a “flipping device”, 2. Die is “flipped” and moved to hover over the substrate (or board or carrier) where bumps reside-precisely positioned in their previously defined positions, 3. The tool then places the die on the bump with a programmed amount of force, Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a “spacer” to prevent electrical shorts and provides mechanical support.

Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.

Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 22.71% of the total sales of global Flip Chip Bonder in 2016. Besi is the world leading manufacturer in Global Flip Chip Bonder market with the market share of 28.64%, in terms of revenue. China market is expected to be the biggest market with sales market share of 25.67% in 2022.

Despite the presence of competition problems, investors are still optimistic about this area, in future still more new investment will enter into the field. Technology and cost are two major problems.

Although sales of Flip Chip Bonder brought a lot of opportunities, for the new entrants with only advantage in capital without sufficient support in technology and downstream channels, the research group did not recommend taking risk enter this market.

The Flip Chip Bonder market was valued at 250 Million US$ in 2018 and is projected to reach 620 Million US$ by 2025, at a CAGR of 12.3% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Flip Chip Bonder.

Global Flip Chip Bonder market competition by top manufacturers, with production, price, and revenue (value) and market share for each manufacturer; the top players including

  • Besi
  • ASM Pacific Technology
  • Shibaura
  • Muehlbauer
  • Kulicke & Soffa
  • Hamni
  • AMICRA Microtechnologies
  • SET

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    The report also focuses on global major leading industry players of Global Flip Chip Bonder market providing information such as company profiles, product picture, and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials and equipment and downstream demand analysis are also carried out. The Global Flip Chip Bonder market development trends and marketing channels are analyzed. Finally, the feasibility of new investment projects are assessed and overall research conclusions offered.

    With tables and figures helping analyze worldwide Global Flip Chip Bonder market, this research provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market.

    By the product type, the market is primarily split into

  • Automatic Flip Chip Bonder
  • Semi-Automatic Flip Chip Bonder

    By the end users/application, this report covers the following segments

  • IDMs
  • OSAT

    The study objectives of this report are:

    • To study and analyze the global Flip Chip Bonder market size (value and volume) by company, key regions/countries, products and application, history data from 2014 to 2018, and forecast to 2025.
    • To understand the structure of the Flip Chip Bonder market by identifying its various sub-segments.
    • To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
    • Focuses on the key global Flip Chip Bonder manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in the next few years.
    • To analyze the Flip Chip Bonder with respect to individual growth trends, future prospects, and their contribution to the total market.
    • To protect the value and volume of Flip Chip Bonder submarkets, with respect to key regions (along with their respective key countries).
    • To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
    • To strategically profile the key players and comprehensively analyze their growth strategies.

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    Major Points from Table of Contents:

    Global Flip Chip Bonder Market Research Report 2019-2025, by Manufacturers, Regions, Types, and Applications

    1 Study Coverage

    1.1 Flip Chip Bonder Product

    1.2 Key Market Segments in This Study

    1.3 Key Manufacturers Covered

    1.4 Market by Type

    1.4.1 Global Flip Chip Bonder Market Size Growth Rate by Type

    1.5 Market by Application

    1.5.1 Global Flip Chip Bonder Market Size Growth Rate by Application

    1.6 Study Objectives

    1.7 Years Considered

     

    2 Executive Summary

    2.1 Global Flip Chip Bonder Production

    2.1.1 Global Flip Chip Bonder Revenue 2014-2025

    2.1.2 Global Flip Chip Bonder Production 2014-2025

    2.1.3 Global Flip Chip Bonder Capacity 2014-2025

    2.1.4 Global Flip Chip Bonder Marketing Pricing and Trends

    2.2 Flip Chip Bonder Growth Rate (CAGR) 2019-2025

    2.3 Analysis of Competitive Landscape

    2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)

    2.3.2 Key Flip Chip Bonder Manufacturers

    2.4 Market Drivers, Trends and Issues

    2.5 Macroscopic Indicator

    2.5.1 GDP for Major Regions

    2.5.2 Price of Raw Materials in Dollars: Evolution

     

    3 Market Size by Manufacturers

    3.1 Flip Chip Bonder Production by Manufacturers

    3.1.1 Flip Chip Bonder Production by Manufacturers

    3.1.2 Flip Chip Bonder Production Market Share by Manufacturers

    3.2 Flip Chip Bonder Revenue by Manufacturers

    3.2.1 Flip Chip Bonder Revenue by Manufacturers (2014-2019)

    3.2.2 Flip Chip Bonder Revenue Share by Manufacturers (2014-2019)

    3.3 Flip Chip Bonder Price by Manufacturers

    3.4 Mergers & Acquisitions, Expansion Plans

     

    4 Flip Chip Bonder Production by Regions

    4.1 Global Flip Chip Bonder Production by Regions

    4.1.1 Global Flip Chip Bonder Production Market Share by Regions

    4.1.2 Global Flip Chip Bonder Revenue Market Share by Regions

    4.2 United States

    4.2.1 United States Flip Chip Bonder Production

    4.2.2 United States Flip Chip Bonder Revenue

    4.2.3 Key Players in the United States

    4.2.4 United States Flip Chip Bonder Import & Export

    4.3 Europe

    4.3.1 Europe Flip Chip Bonder Production

    4.3.2 Europe Flip Chip Bonder Revenue

    4.3.3 Key Players in Europe

    4.3.4 Europe Flip Chip Bonder Import & Export

    4.4 China

    4.4.1 China Flip Chip Bonder Production

    4.4.2 China Flip Chip Bonder Revenue

    4.4.3 Key Players in China

    4.4.4 China Flip Chip Bonder Import & Export

    4.5 Japan

    4.5.1 Japan Flip Chip Bonder Production

    4.5.2 Japan Flip Chip Bonder Revenue

    4.5.3 Key Players in Japan

    4.5.4 Japan Flip Chip Bonder Import & Export

    4.6 Other Regions

    4.6.1 South Korea

    4.6.2 India

    4.6.3 Southeast Asia

     

    5 Flip Chip Bonder Consumption by Regions

    5.1 Global Flip Chip Bonder Consumption by Regions

    5.1.1 Global Flip Chip Bonder Consumption by Regions

    5.1.2 Global Flip Chip Bonder Consumption Market Share by Regions

    5.2 North America

    5.2.1 North America Flip Chip Bonder Consumption by Application

    5.2.2 North America Flip Chip Bonder Consumption by Countries

    5.2.3 United States

    5.2.4 Canada

    5.2.5 Mexico

    5.3 Europe

    5.3.1 Europe Flip Chip Bonder Consumption by Application

    5.3.2 Europe Flip Chip Bonder Consumption by Countries

    5.3.3 Germany

    5.3.4 France

    5.3.5 UK

    5.3.6 Italy

    5.3.7 Russia

    5.4 Asia Pacific

    5.4.1 Asia Pacific Flip Chip Bonder Consumption by Application

    5.4.2 Asia Pacific Flip Chip Bonder Consumption by Countries

    5.4.3 China

    5.4.4 Japan

    5.4.5 South Korea

    5.4.6 India

    5.4.7 Australia

    5.4.8 Indonesia

    5.4.9 Thailand

    5.4.10 Malaysia

    5.4.11 Philippines

    5.4.12 Vietnam

    5.5 Central & South America

    5.5.1 Central & South America Flip Chip Bonder Consumption by Application

    5.5.2 Central & South America Flip Chip Bonder Consumption by Countries

    5.5.3 Brazil

    5.6 The Middle East and Africa

    5.6.1 The Middle East and Africa Flip Chip Bonder Consumption by Application

    5.6.2 The Middle East and Africa Flip Chip Bonder Consumption by Countries

    5.6.3 Turkey

    5.6.4 GCC Countries

    5.6.5 Egypt

    5.6.6 South Africa

     

    6 Market Size by Type

    6.1 Global Flip Chip Bonder Breakdown Dada by Type

    6.2 Global Flip Chip Bonder Revenue by Type

    6.3 Flip Chip Bonder Price by Type

     

    7 Market Size by Application

    7.1 Overview

    7.2 Global Flip Chip Bonder Breakdown Dada by Application

    7.2.1 Global Flip Chip Bonder Consumption by Application

    7.2.2 Global Flip Chip Bonder Consumption Market Share by Application (2014-2019)

    Continued…

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